LGE3556C LGE3556 LGE3556CP LCD BGA 0.6 MM solder ball ukuran chip steel mesh steel mesh Template Stensil

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LGE3556C LGE3556 LGE3556CP LCD BGA 0.6 MM solder ball ukuran chip steel mesh steel mesh Template Stensil

Tag:Sirkuit Terpadu, Murah Sirkuit Terpadu, LGE3556C LGE3556 LGE3556CP LCD BGA 0.6 MM Solder Ball Ukuran Chip Steel Mesh Steel Mesh Template Stensil.

Berat Paket 0.05kg (0.11lb.)
Tipe Unit bagian
Paket Ukuran 1cm x 1cm x 1cm (0.39in x 0.39in x 0.39in)
Aplikasi TV
Suhu operasi kristal cair
Disipasi Daya kristal cair
Jenis sirkuit terpadu IC LCD chip
Paket BGA
Pasokan Tegangan LCD chip
Nama Merek CYTX
Nomor Model LGE3556C LGE3556 LGE3556CP LCD BGA 0.6 MM solder ball ukuran chip
Kondisi BARU

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LGE3556C LGE3556 LGE3556CP LCD BGA 0.6 MM solder ball ukuran chip steel mesh steel mesh Template Stensil

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